On November 24th, at the Foundation’s headquarters, C/ Llorens y Artigas 12, Barcelona

CIM UPC ORGANIZES ITS HIGH-IMPACT EVENT “DISCOVER THE FUTURE OF DIW TECHNOLOGY”

The future of personalized manufacturing is already here. With technologies like DIW, barriers related to materials, geometry, functional integration, and sustainability are being overcome. This free event (registration required) offers a unique opportunity to witness this revolutionary technology in action, connect with leading researchers and companies already implementing it, and position participating organizations at the forefront of personalized manufacturing.

Barcelona, November 7, 2025 —-TheFundació Centre CIM, also known as CIM UPC, a part of the Universitat Politècnica de Catalunya – BarcelonaTech (UPC), is organizing its high-impact event “Discover the Future of DIW Technology.”

The event will take place on November 24th, from 9:00 AM to 1:00 PM, at the Foundation’s headquarters (C/ Llorens y Artigas 12) in Barcelona.

This event invites professionals, companies, researchers, and R&D managers to gain first-hand insight into DIW technology applied in real personalized manufacturing environments. It will feature success stories, discussions on technological challenges, and a guided tour of the CIM UPC pilot plant. The event also provides excellent networking opportunities and the chance to identify new business and collaboration prospects.

Currently, DIW technology represents a key evolution in additive manufacturing: it enables the extrusion of highly viscous materials, multi-material printing, modular configurations… In short, it marks the leap from research to industrial application. DIW aligns with Industry 4.0, the circular economy, and high-value sectors such as regenerative medicine, advanced electronics, and energy.

For attendees, this event offers unique benefits:

a) See the process of this cutting-edge technology live.
b) Learn how to implement DIW additive manufacturing in real industrial settings, connecting with researchers and companies already using it (high-value networking with leading speakers and professionals).
c) Enjoy an immersive experience visiting the CIM UPC pilot plant (see, touch, experiment).
d) Position attending organizations as innovative and ready for change.

Event program

The agenda for the day is as follows:

9:00 – 9:15 Registration

9:15 – 9:20 Institutional Welcome. Juliana Breda (CIM UPC Technology Transfer Coordinator).

9:20 – 9:35 “Transforming Industries with the Most Advanced and Powerful System on the Market”. Andrea Gusano (Project Manager de PoweDIW).

PowerDIW technology is revolutionizing multiple sectors through CIM UPC’s proprietary advanced 3D printing system, capable of printing highly viscous and dense materials with unprecedented precision. This talk will explore the unique advantages of the system: 800 N extrusion force, compatibility with a wide range of materials, modular configuration, and full customization for each client. Applications span high-value sectors such as regenerative medicine, medical devices, advanced electronics, energy, industrial manufacturing, and pharma-chemicals. With PowerDIW, we don’t just print complex materials—we print the future.

9:35 – 10:20 “DIW: Transforming Mining Waste into Green Hydrogen Technology”. Dr. Claudio Aguilar (Associate Professor, UTFSM).

Direct Ink Writing: cases of transforming mining waste into green hydrogen technology. DIW additive manufacturing converts copper slags into functional metal parts through 3D printing and sintering. With PowerDIW 800N, dense and strong components are produced, promoting circular economy practices in mining. This innovation drives clean technologies such as green hydrogen, combining sustainability and industrial efficiency.

10:20 – 11:05 “3D Electronics AM by DIW: Challenges and Functional Integration”. Daniel Rodriguez del Rosario (Researcher, AIMPLAS).

This talk will cover AIMPLAS’s advances and challenges in 3D electronics manufacturing using DIW technologies. Key issues related to functional ink printing will be addressed, comparing DIW’s performance with other flexible electronics technologies such as screen printing or inkjet. Strategies for integration on thermoplastic and flexible substrates, as well as examples in sensor, heater, and embedded circuit development in 3D parts, will be presented, highlighting DIW advantages in multi-material and advanced manufacturing environments.

11:05 – 11:50 “Metallic Scaffold Fabrication for Biomedical Applications via DIW”
Dr. Daniel Rodriguez Rius (Associate Professor, BBT-UPC)

Biocompatible metal alloys, particularly titanium and iron, are promising in biomedical applications due to their excellent mechanical properties and, in the case of iron, controlled reabsorption. Challenges in conventional alloying processes have led to exploring DIW for creating porous alloyed structures.

11:25 – 12:20 CIM UPC Facility Tour.

12:20 – 13:00 Networking and Refreshments.

Free admission with prior registration: https://www.eventbrite.es/e/descubre-el-futuro-de-la-tecnologia-diw-tickets-1850967175649?aff=oddtdtcreator

Event Language: Spanish

About CIM UPC

Leading in 3D printing, CIM UPC’s mission is to transfer engineering and technology management knowledge, providing companies and professionals with tools to create and improve products and manufacturing processes. Committed to society and industry, CIM UPC advances digital manufacturing and production technologies through education, technology transfer, and research, bridging academia and the industrial sector to maximize technological competitiveness.

Since its foundation, CIM UPC has been versatile in its activities, including:

Pilot Plant, offering customized prototype and pre-series production through 3D printing and advanced machining, as well as various laboratories for different tests using innovative Direct Ink Writing printers and other technologies for industrial projects, particularly for the fabrication of metal parts.
Design and production of custom Advanced Manufacturing equipment, enabling new 3D printing-based production processes.
Open innovation: national and international research projects, including the XaRFA network (Reference Network in Additive Manufacturing of Catalonia).
Design, production, and sale of desktop 3D printers for professionals and companies (models derived from spin-offs BCN3DandARIDDITIVE).

CIM UPC was founded in 1990 and became a foundation of the Universitat Politècnica de Catalunya – BarcelonaTech (UPC) in 2005. Since then, the organization, now celebrating its 35th anniversary, has also collaborated with other technological and/or university research centers and leads the aforementioned XaRFA, a network focused on advanced manufacturing. Finally, it develops innovative technological proposals and promotes applied research infrastructures to carry out projects across various technological fields.

More information: CIM UPC: https://www.cimupc.org

Note: for further information about this press release, please contact Mar Borque. Tel: 610011713. E-mail: publicidad@marborque.es.

Web: https://marborqueconsultoradecomunicacion.my.canva.site